creat by art - ul recognized file # e-326243 - ideal for printed circuit board - high case dielectric strength - high surge current capability - halogen-free according to iec 61249-2-21 definition v rrm v v rms v v dc v i 2 ta 2 s i r ua t j o c t stg o c document number ds_d1312019 version:j13 operating junction temperature range - 55 to + 150 storage temperature range - 55 to + 150 note 1: pulse test with pw=300 usec,1% duty cycle typical thermal resistance r jc r jl r ja 8.2 9.3 14 o c/w maximum instantaneous forward voltage (note 1) if= 2 a v f 1.0 v maximum dc reverse current at rated dc blocking voltage 10 a peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 135 a rating of fusing ( t < 8.3ms) 75 maximum dc blocking voltage 600 800 1000 maximum average forward current without heat sink t c =120 60hz sine wave resistance load with heat sink t c =138 i f(av) 2 4 maximum repetitive peak reverse voltage 600 800 1000 maximum rms voltage 420 560 700 mounting torque : 0.8 n.m max. maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter symbol ur4kb 60 ur4kb 80 ur4kb 100 unit d3k mechanical data case d3k molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free, rohs compliant terminal matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test weight 1.24 gram (approximately) ur4kb60 thru ur4kb100 taiwan semiconductor glass passivated brid g e rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec
part no. part no. ur4kb60 ur4kb60 (ta=25 unless otherwise noted) document number ds_d1312019 version:j13 ur4kb60 c2g c2 g green compound ratings and characteristics curves example preferred p/n packing code green compound code description ur4kb60 c2 c2 ur4kbx0 (note 1) c2 suffix "g" d3k 1500 / box note 1: "x" defines voltage from 600v (ur4kb60) to 1000v (ur4kb100) ur4kb60 thru ur4kb100 taiwan semiconductor ordering information packing code green compound code package packing 0 1 2 3 4 5 0 25 50 75 100 125 150 average forward a current (a) case temperature ( o c) fig.1 forward current derating curve without heat sink with heat sink 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2 maximum non-repetitive forward surge current 8.3ms single half sine wave (jedec method) 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 instantaneous reverse a current (ua) percent of rated peak reverse voltage (%) fig. 3 typical reverse characteristics tj=25 tj=125 0.1 1 10 100 0.4 0.6 0.8 1 1.2 1.4 instantaneous forward a current (a) forward voltage (v) fig. 4 typical forward characteristics tj=25 tj=125
min max min max a 13.50 14.10 0.531 0.555 b 0.70 1.40 0.028 0.055 c 11.70 12.30 0.461 0.484 d 10.50 11.10 0.413 0.437 e 11.70 12.30 0.461 0.484 f 1.10 1.40 0.043 0.055 g 3.51 4.11 0.138 0.162 h 6.70 7.30 0.264 0.287 i 1.10 1.50 0.043 0.059 j 1.05 1.25 0.041 0.049 k 0.66 0.86 0.026 0.034 l 2.90 3.30 0.114 0.130 m 2.40 2.80 0.094 0.110 n 3.10 3.40 0.122 0.134 o 1.00 1.40 0.039 0.055 p 0.40 0.80 0.016 0.031 q 1.80 2.40 0.071 0.094 r 0.40 0.60 0.016 0.024 p/n = specific device code g = green compound yww = date code f = factory code document number ds_d1312019 version:j13 marking diagram ur4kb60 thru ur4kb100 taiwan semiconductor package outline dimensions dim. unit(mm) unit(inch) 0 1 2 3 4 5 6 7 00.511.522.53 power dissipation(w) forward rectified current io (a) fig. 5 forward power dissipation
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